Welcome to MSIM
2027 3rd International Conference on Electrical Engineering and Intelligent Systems
Countdown to the Conference:
☀ About MSIM
2027 5th International Conference on Materials Science and Intelligent Manufacturing(MSIM 2027) will be held in Xi’an, China from January 8 to 10, 2027. MSIM is an annual conference providing a yearly platform for delegates and members to present and discuss the latest research, and our delegates and members will have many opportunities engage in dialogues about Materials Science and Intelligent Manufacturing. It also provides new insights and bring together scholars, scientists, engineers and students from universities and industry all over the world under one roof. We warmly invite you to participate in MSIM and look forward to seeing you in MSIM!
 | January 8-10, 2027 Conference Dates |
| November 25, 2026 Full Paper Submission Date |
 | December 12, 2026 Registration Deadline |
 | December 26, 2026 Final Paper Submission Date |
☀ Topics
The topics of interest for submission include, but are not limited to:
Materials Science and Engineering
Electronic and magnetic materials; Computational materials Science; Coupling of multiple iron sequence parameters; Crystal defect engineering; Crystallography engineering; Domain microstructure evolution; Domain size effect, grain size effect, small particles, thin films; Nanomaterials and nanotechnology; Phase transition between iron and iron; Fundamentals and characteristics; Giant magnetostrictive materials and magnetic shape memory alloys; Kinetic pathways of phase transition and domain change; Magnetic materials; Materials chemistry; Multiferroic materials and composites; Nanotechnology and materials; Shape memory alloys and martensite
Intelligent Manufacturing
Production process simulation; Modeling and design; Intelligent system; Intelligent mechatronics; Micromachining technology; Advanced manufacturing technology; Sustainable production; Recycling and remanufacturing; Fast manufacturing; Digital manufacturing (CAx, CAPP, MES, DES, etc.); Microelectronics packaging technology and equipment; Integrated manufacturing system; Engineering optimization; Systems analysis and industrial engineering; Modeling, analysis and simulation of manufacturing processes; Testing, measurement, monitoring and control of manufacturing processes
☀ Publication
All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus for indexing.
MSIM 2023丨Publication丨EI Compendex丨Scopus
MSIM 2024丨Publication丨EI Compendex丨Scopus
MSIM 2025丨Publication丨EI Compendex丨Scopus
Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.